P R O C E S S C A P A B I L I T Y

Technological parameter table of Fast Turn PCB rigid board
project name Technical capability parameters
material type Ordinary Tg FR4 Shengyi S1141 & KB (Not recommended for lead-free soldering process)
Ordinary Tg FR4 (halogen-free) Shengyi S1155
High Tg FR4 (halogen-free) Shengyi S1155
HDI board material type LDPP (IT-180A 1037 and 1086), ordinary 106 and 1080
High CTI Shengyi S1600
High Tg FR4 Isola: FR408, FR408HR, IS410, PCL-370HR; Lianmao: IT-180A, IT-150DA; Nelco: N4000-13, N4000-13EP, N4000-13SI, N4000-13EP SI; Panasonic: R-5775K (Megtron6) R-5725 (Megtron4) Tai Yao: TU-768, TU-662; Tenghui: VT-47;
Ceramic powder filled high frequency material Rogers:Rogers4350、Rogers4003
Material mixing Rogers, Nelco and FR-4
product type Rigid plate Backplane, HDI, multilayer buried blind via, buried capacitor, buried resistance, thick copper plate, power supply thick copper, semiconductor test board
Lamination method Repeatedly pressed blind buried plate Lamination on the same side≤3
HDI board type 1 + n + 1, 1 + 1 + n + 1 + 1, 2 + n + 2, 3 + n + 3 (buried holes in n≤0.3mm), laser blind holes can be filled by plating
Surface treatment Surface treatment type (lead-free) Electroplated copper nickel gold, immersion gold, hard gold (with / without nickel), gold-plated fingers, lead-free tin spray, OSP, chemical nickel-palladium, soft gold (with / without nickel), immersion silver, immersion tin, ENIG + OSP, ENIG + G / F, Full Plate Gold + G / F, Immersion Silver + G / F, Immersion Tin + G / F
Surface treatment type (lead) Lead spray
Thickness to diameter ratio 10 1 (lead / lead-free tin spray chemically nickel-precipitated gold, silver, immersion tin, chemical nickel-palladium) 8 1 (OSP)
Processing size (MAX) Lead spray
Surface treatment type (lead) Lead sprayed 22 "* 39"; lead-free sprayed 22 "* 24"; gold-plated fingers 24 "* 24"; hard gold-plated 24 "* 28"; chemical immersion gold 21 "* 27"; copper-nickel plated Gold 21 "* 48"; Shen tin 16 "* 21"; Shen silver 16 "* 18"; OSP24 "* 40";
Processing size (MIN) Lead sprayed 5 "* 6"; lead free sprayed 10 "* 10"; gold-plated fingers 12 "* 16"; hard gold plated 3 "* 3"; picture copper-nickel gold 8 "* 10"; 2 "* 4"; Shen Yin 2 "* 4"; OSP2 "* 2";
Processing plate thickness Lead spray tin 0.6-4.0mm; lead-free tin spray 0.6-4.0mm; gold-plated fingers 1.0-3.2mm; hard gold plating 0.1-5.0mm; chemical immersion gold 0.2-7.0mm; copper-plated nickel gold 0.15-5.0mm ; Shen tin 0.4-5.0mm; Shen silver 0.4-5.0mm; OSP 0.2-6.0mm;
Cheat height 1.5inch
Minimum spacing between cheats 6mil
Segment golden finger minimum segment spacing 7.5mil
Surface plating (covering layer) thickness Spray tin 2-40um (the thinnest thickness of the large tin surface with lead spray is 0.4um, the thinnest thickness of the large tin surface with lead spray is 1.5um)
OSP Film thickness: 0.2-0.6um
Electroless nickel Gold thickness 0.05-0.10um, nickel thickness 3-8um
Chemical Immersion Silver Silver thickness 0.2-0.4um
Chemical precipitation Tin thick≥1.0
Electroplated hard gold Gold thickness 0.10-1.5um (dry film pattern plating process), gold thickness 0.10-4.0um (non-dry film pattern plating process)
Electroplated soft gold Gold thickness 0.10-1.5um (dry film pattern plating process), gold thickness 0.10-4.0um (non-dry film pattern plating process)
Chemical nickel palladium Gold thickness 0.05-0.10um, nickel thickness 3-8um, palladium thickness 0.05-0.15um
Electroplated copper nickel gold Gold thickness 0.025-0.10um, nickel thickness ≥3um, base copper thickness up to 1OZ
Gold finger nickel plated Gold thickness 0.25-1.5um (required value refers to the thinnest point), nickel thickness ≥3um
Carbon oil 0.1-0.35mm
green oil Copper surface cover oil (10-18um), via hole cover oil (5-8um), ≥5um at the corner of the line
Blue glue 0.20-0.80mm
drilling 0.1/0.15/0.2mmMaximum plate thickness for mechanical drilling 0.8mm/1.5mm/2.5mm
Minimal laser drilling aperture 0.1mm
Maximum laser drilling aperture 0.15mm
Machine hole diameter (finished product) 0.15-6.2mm(Corresponding drill0.2-6.3mm)
Minimum finished hole diameter of PTFE material (including mixed pressure) plate is 0.25mm
Mechanical buried blind hole diameter ≤0.3mm (corresponding to 0.4mm drill bit)
In the plate, the diameter of the green oil plug hole is ≤0.45mm (corresponding to 0.55mm of the drill)
Minimum hole diameter 0.35mm (corresponding to 0.45mm drill)
The minimum diameter of metallized half-holes is 0.30mm (corresponding to 0.4mm)
Through-hole plate thickness to diameter ratio is the largest 20: 1 (excluding 0.2mm blade diameter;> 12: 1 to be evaluated)
Laser drilling depth to maximum aperture ratio 1:1
Maximum depth-to-aperture ratio of blind hole in mechanically controlled deep drilling 1.3: 1 (aperture ≤0.20mm), 1.15: 1 (aperture ≥0.25mm)
Minimal depth of mechanically controlled deep drill (back drill) 0.2mm
Drilling-the minimum distance from mechanical drilling to the conductor (non-buried blind hole plate and first-order laser blind hole) 5.5mil (≤8 layers); 6.5mil (10-14); 7mil (> 14 layers)
Drilling-the minimum distance from mechanical drilling to the conductor (mechanical buried blind plate and second-order laser buried blind hole) 7mil (one press); 8mil (second press); 9mil (three press)
Drilling-the minimum distance from mechanical drilling to the conductor (laser blind buried hole) 7mil(1+N+1);8mil(1+1+N+1+1or2+N+2)
Drilling-laser drilling to the minimum body distance of conductor (1st, 2nd order HDI board) 5mil
Drilling-minimum distance between holes in different networks (after compensation) 10mil
Drilling-minimum distance between holes in the same network (after compensation) 6mil (through hole; laser blind hole); 10mil (mechanical blind buried hole)
Minimum distance between drilling and non-metallic hole wall (after compensation) 8mil
Drilling-hole position tolerance (compared with CAD data) ±2mil
Drilling-NPTH hole diameter tolerance is the smallest ±2mil
Drilling-solderless device hole diameter accuracy ±2mil
Drilling-tapered hole depth tolerance ±0.15mm
Drilling-taper hole orifice diameter tolerance ±0.15mm
Pad (ring) Minimal laser pad inner and outer pad size 10mil (4mil laser hole), 11mil (5mil laser hole)
Minimal mechanical pad via inner and outer pad size 16mil (8mil aperture)
Minimal BGA pad diameter 10mil lead spray process, 12mil lead-free spray process, 7mil for other processes
Pad tolerance (BGA) +/- 1.2mil (pad <12mil); +/- 10% (pad ≥12mil)
Line width / space Inner layer 1/2OZ:3/3mil
1OZ: 3/4mil
2OZ: 4/5mil
3OZ: 5/8mil
4OZ: 6/11mil
5OZ: 7/13.5mil
6OZ: 8/15mil
7OZ: 9/18mil
8OZ: 10/21mil
9OZ: 11/24mil
10OZ: 12/27mil
Outer layer 1/3OZBase copper:3/3mil
1/2OZBase copper:3.5/3.5mil
1OZBase copper: 4.5/5mil
1.43OZBase copper (positive):4.5/6
1.43OZBase copper (negative):5/7
2OZBase copper: 6/7mil
3OZBase copper: 6/10mil
4OZBase copper: 7.5/13mil
5OZBase copper: 9/16mil
6OZBase copper: 10/19mil
7OZBase copper: 11/22mil
8OZBase copper: 12/26mil
9OZBase copper: 13/30mil
10OZBase copper: 14/35mil
Line width tolerance ≤10mil:+/-1.0mil
>10mil:+/-1.5mil
Solder mask character Maximum drilling diameter of solder plug hole (both sides covered with oil) 0.9mm
Solder mask ink color Green, yellow, black, blue, red, white, purple, green matte
Character ink color White, yellow, black
Maximum diameter of blue plastic aluminum plug hole 5mm
Resin plug hole drilling hole diameter range 0.1-1.0mm
Resin plug hole thickness to diameter ratio 10:1
Solder mask character-minimum width of solder mask Base copper ≤ 0.5OZ, surface treatment is sinking tin: 7.5 (black), 5.5 (other colors), 8.0 (soldering bridge on large copper surface)
Base copper ≤0.5OZ, other surface treatments other than Shen tin: 5.5 (black, limit 5), 4 (other colors, limit 3.5), 8.0 (soldering bridge on large copper surface)
Base copper 1OZ: 4 (green), 5 (other colors), 5.5 (black, limit 5), 8.0 (soldering bridge on large copper surface)
Base copper 1.43oz: 4 (green), 5.5 (other colors), 6 (black), 8.0 (solder mask on large copper surface)
Base copper 2-4OZ: 6, 8 (soldering bridge on large copper surface)
shape V-CUT does not leak copper centerline to graphic distance H≤1.0mm:0.3mm(20°V-CUT angle)、0.33mm(30°)、0.37mm(45°);
1.0 < H≤1.6mm:0.36mm(20°)、0.4mm(30°)、0.5mm(45°);
1.6 < H≤2.4mm:0.42mm(20°)、0.51mm(30°)、0.64mm(45°);
2.4<H≤3.2mm:0.47mm(20°)、0.59mm(30°)、0.77mm(45°);
V-CUTSymmetry tolerance ±4mil
V-CUTMaximum number of lines article
V-CUTAngular tolerance ±5degree
Chemical nickel V-CUT angle specification Palladium 20、30、45degree
Cheat angle 20、30、45、60degree
Gold finger chamfer angle tolerance ±5degree
The minimum distance for TAB to avoid injury 6mm
The minimum distance between the side of the gold finger and the edge of the profile 8mil
Depth Controlled Milling (Edge) Depth Accuracy (NPTH) ±0.10mm
Dimensional accuracy (side-to-side) ±4mil
Minimum tolerance for milling slot (PTH) Slot width and slot length are both ± 0.13mm
Minimum Tolerance for Milling Slots (NPTH) Slot width and slot length are both ± 0.10mm
Minimum tolerance for drilling slot (PTH) Slot width direction ± 0.075mm; slot length / slot width <2: Slot length direction +/- 0.1mm; slot length / slot width ≥2: slot length direction +/- 0.075m
Minimum Tolerance for Drilling Slots (NPTH) Slot width direction ± 0.05mm; slot length / slot width <2: Groove length +/- 0.075mm; Groove length / groove width ≥2: Groove length +/- 0.05mm
Local mixed pressure Minimum distance from drilled hole to conductor in local mixed area 12(Local10)mil
Minimum distance from local mixed pressure junction to borehole 10mil
Metal substrate Layers Aluminum substrate, copper substrate: 1-8 layers;
Finished product size (aluminum substrate, copper substrate, cold plate, sintered plate, buried metal plate) MAX:610*610mm、MIN:5*5mm
Largest production size (ceramic plate) 100*100mm
Finished plate thickness 0.5-5.0mm
Copper thickness 0.5-10 OZ
Metal base thickness 0.5-4.5mm
Metal base material AL:1100/1050/2124/5052/6061;Copper:Copper pure iron
Minimum finished hole diameter and tolerance NPTH: 0.5 ± 0.05mm; PTH (aluminum substrate, copper substrate): 1.0 ± 0.1mm; PTH (cold plate, sintered plate, buried metal plate): 0.2 ± 0.10mm;
Shape processing accuracy ±0.03mm
PCB part surface treatment process Yes / Lead-free tin spray; OSP; Immersion nickel (palladium) gold; Electric (nickel) soft / hard gold; electroplated tin; nickel-free electroplated soft and hard gold;
Metal surface treatment Copper: nickel-plated gold; aluminum: anodizing, hard oxidation, chemical passivation; mechanical treatment: dry sandblasting, wire drawing
Metal-based material Quanbao aluminum substrate (T-110, T-111); Tenghui aluminum substrate (VT-4A1, VT-4A2, VT-4A3); Laird aluminum substrate (1KA04, 1KA06); Beggs metal substrate (MP06503) , HT04503); TACONIC metal substrate (TLY-5, TLY-5F);
Thermal adhesive thickness (dielectric layer) 75-150um
Buried copper block size 3*3mm—70*80mm
Flatness of buried copper block (fall accuracy) ±40um
Buried copper block to hole wall distance ≥12mil
Thermal conductivity 0.3-3W / m.k (aluminum substrate, copper substrate, cold plate); 8.33W / m.k (sintered plate); 0.35-30W / m.k (buried metal plate); 24-180W / m.k (ceramic plate);
other Complete copper thickness maximum 12 inner layer: 10 OZ; outer layer: 11 OZ
Outer finished copper thickness 12, 18um base copper: ≥35.8 (reference value: 35.8-42.5); ≥40.4 (reference value: 40.4-48.5)
35, 50, 70um base copper: ≥55.9; ≥70; ≥86.7
105, 140um base copper: ≥117.6; ≥148.5
Circuit board layers 1-40 layers
Finished plate thickness 0.20-7.0mm (no solder mask); 0.40-7.0mm (with solder mask);
Board thickness tolerance (conventional) Board thickness ± 10% (> 1.0mm); ± 0.1mm (≤1.0mm);
Plate thickness tolerance (special) Board thickness ± 0.1mm (≤2.0mm); ± 0.15mm (2.1-3.0mm)
Minimum finished product size 10 * 10mm (no internal positioning jigsaw design; jigsaw below 50 * 50)
Maximum finished product size 23 * 35inch (double panel); 22.5 * 33.5inch (four-layer board); 22.5 * 30 (≥ six-layer board);
Ion pollution ≤1ug/cm2
Warp limit ability 0.1% (This ability requires the same type of laminated board, strict symmetry of the laminated layer, the difference of the residual copper ratio of the symmetrical layer within 10%, uniform wiring, no concentrated large copper skin or substrate, and the laminated board does not contain light boards and single panels , And the size of the long side of the panel is ≤ 21 inches;)
Impedance tolerance ±5Ω( <50Ω),±10%(≥50Ω);
Plating hole filling laser blind hole diameter 4-5mil (preferably 4mil)
Plating hole filling blind hole has the largest deep hole diameter ratio 1:1(Depth is copper-containing thickness)