Layers:8
Material:Ro3003+FR 180
Surface finish:ENIG
Board Thickness:1.2mm
Board size:0mm*0mm(0ups)
Copper Thickness:0.5oz

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Layers:8
Material:Ro3003+FR 180
Surface finish:ENIG
Board Thickness:1.2mm
Board size:0mm*0mm(0ups)
Copper Thickness:0.5oz
Solder mask:Red
Silkscreen:White
Impedance:Yes
Min hole wall:1 mil
IPC Standard:IPC Class 2
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