The PCB surface mount processing technology covers raw material preparation, PCB board making, SMT surface mount, DIP packaging, BGA packaging, and subsequent processing and testing. Each link is related to product performance and quality.
1、 Raw material preparation
Everything starts with high-quality raw materials. The selection and inspection of materials such as PCB boards, electronic components, solder paste, etc. are the first step in the process. High quality raw materials are the foundation for ensuring smooth processing and stable product performance in the future.
2、 PCB board making
PCB board making is the process of transforming a designed circuit diagram into an actual circuit board. This includes a series of complex processes such as board cutting, hole drilling, electroplating, etc. Accurate board thickness control, reasonable circuit layout, and high-quality coating processes are all key to ensuring the quality of PCB boards.
3、 SMT surface mount technology
SMT is one of the core processes in PCB surface mount processing. It achieves high-density and high-precision assembly by directly soldering electronic components onto the surface of the PCB. The specific steps include solder paste printing, component mounting, and reflow soldering.
4、 DIP Dual In Line Packaging Technology
Unlike SMT, DIP is suitable for components with larger volumes and more pins. Its processing flow includes steps such as component insertion and wave soldering to ensure a stable connection between the components and the PCB.
5、 BGA Ball Grid Array Packaging Technology
BGA is an advanced packaging method widely used in high-performance electronic products. It connects components to PCBs through a spherical pad array and has advantages such as high density and high reliability. The BGA soldering process requires extremely high precision, including precise alignment of the ball grid array, strict temperature and time control, etc.
6、 Subsequent processing and testing
After welding, subsequent treatments such as cleaning and coating with protective materials are required to improve the moisture, dust, and corrosion resistance of the PCB board. At the same time, comprehensive inspection of PCBA boards is carried out through various methods such as automatic optical inspection (AOI), online testing (ICT), and functional testing (FCT) to ensure product quality meets design requirements.
