In SMT technology, the stencil is a seemingly simple yet extremely critical component. It is a thin metal plate with holes precisely etched on it according to the PCB design, corresponding to the component pads. These holes play a role in guiding the solder paste during the soldering process, ensuring that the solder paste can be accurately deposited onto the designated position on the PCB, laying the foundation for subsequent component mounting and soldering.

1. Accurately control the soldering amount
The size and shape of the holes in the steel mesh are carefully designed to precisely control the amount of solder required for each solder joint. This not only avoids the risk of short circuit caused by excessive soldering, but also prevents poor soldering caused by insufficient soldering, thereby ensuring product quality.
2. Improve production efficiency
By using steel mesh, SMT equipment can quickly and evenly apply solder paste onto PCBs, significantly improving production efficiency. A highly automated SMT line can complete the tinning of dozens or even hundreds of solder joints per second, thanks to the efficient conductivity of the steel mesh.

3. Reduce material waste
The precise design of the steel mesh means that the solder paste will only be applied in the required positions, greatly reducing material waste and lowering production costs. This is crucial for SMT surface mount processing factories that pursue lean production and improve competitiveness.
4. Adapt to diverse designs
With the increasing complexity of electronic product design, the layout of components on PCBs is also becoming more diverse. Steel mesh can flexibly respond to such changes and meet the special requirements of different products for solder distribution through customized etching design.