The surface treatment process of PCB has a significant impact on the performance, reliability, and durability of the circuit board. Here are some common PCB surface treatment processes and their applicable scenarios:
1. Lead Free HASL:
Applicable scenarios: Lead free tin spraying is an environmentally friendly surface treatment method suitable for most general applications. It provides good welding performance and is suitable for welding through hole components.
2. ENIG, Electroless Nickel Immersion Gold：
Applicable scenarios: Electroplated gold is commonly used for high reliability, high performance, and high-frequency applications, such as communication equipment, aerospace, and medical devices. It provides a smooth, corrosion-resistant surface that helps improve welding performance.
3. Electroplated Tin:
Applicable scenarios: Electroplated tin plating is an economical surface treatment method suitable for general applications, especially consumer electronics products. It provides good welding performance, but relatively less corrosion resistance than other processing methods.
4. Hot Air Solder Leveling :
Applicable scenarios: HASL is a common surface treatment method that is suitable for general applications and has a low cost. However, it may not be suitable for small-sized components as it may leave uneven surfaces on them.
5. Electroplated Gold:
Applicable scenarios: Sinking gold is a precious metal surface treatment method commonly used in high-end applications such as aerospace, medical instruments, and precision instruments. Sinking gold provides high conductivity and excellent corrosion resistance.
6.Organic Solderability Preservatives：
Applicable scenario: OSP is an organic solder protectant suitable for SMT (Surface Mount Technology) components. It provides good welding performance in the short term, but relatively poor corrosion resistance, suitable for consumer electronic products used in the short term.
7. ENEPIG, Electroless Nickel Electroless Palladium Immersion Gold：
Applicable scenarios: ENEPIG is a high-performance surface treatment method suitable for high-density, high-frequency, and high reliability applications, such as advanced electronic and communication devices.
When choosing the surface treatment process for PCB boards, it is necessary to consider the specific application scenarios, performance requirements, and budget. Different surface treatment methods have their own advantages and disadvantages, and choosing the method that suits the project requirements is a key factor in ensuring the performance and reliability of the circuit board.
