Layers:4
Material:FR4 Tg170
Surface finish:ENIG
Board Thickness:1.2mm
Board size:112mm*94mm(12ups)
Copper Thickness:1 oz

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Layers:4
Material:FR4 Tg170
Surface finish:ENIG
Board Thickness:1.2mm
Board size:112mm*94mm(12ups)
Copper Thickness:1 oz
Solder mask:Green matt
Silkscreen:White
Impedance:Yes
Min hole wall:1 mil
IPC Standard:IPC Class 2
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