As the core component of industrial automation control, the manufacturing process of industrial control boards has extremely high requirements for accuracy and reliability. The following will explore in depth from the aspects of component preparation, printing and board making, mounting, welding, testing, and subsequent processing.
1. Component preparation and screening
Before SMT surface mount processing, strict specifications, models, and quality checks and tests need to be conducted on the components to ensure that all components meet production requirements and quality standards. It is also necessary to clean and dry the components to prevent poor soldering caused by contamination.
2. Printing board and solder paste coating
Printed circuit board is the first step in SMT processing, which involves transferring circuit patterns onto the surface of the PCB through lithography technology to form conductive lines. Subsequently, it is necessary to evenly and accurately apply the solder paste onto the solder pads of the PCB using a wire mesh or steel mesh. This step requires strict control of the thickness, viscosity, and position of the solder paste to ensure the quality of subsequent welding.
3. Application of high-precision automatic bonding equipment
In SMT surface mount processing, mounting is one of the key steps. High precision automation equipment is required to accurately place the components onto the designated positions on the PCB. This process is usually completed by high-speed surface mount machines, and the quality of the mounting directly affects the firmness of subsequent welding and the overall performance of electronic devices.
4. High control requirements for reflow soldering
Reflow soldering is an important step in SMT processing, which sends the circuit board with installed components into a reflow oven for heating, melting the solder paste and soldering it to the solder terminals or pins of the components. This process requires strict control of temperature and time to ensure the quality of welding. Excessive temperature or prolonged time can cause damage to PCBs or components.
5. Improve the quality inspection and control process
Quality inspection and control are indispensable links in the SMT surface mount processing. It is necessary to conduct a comprehensive inspection of the soldered PCB using AOI (Automatic Optical Inspection), X-Ray inspection, and other methods to ensure that there are no issues such as poor soldering or short circuits. At the same time, functional testing is also required to ensure that electronic devices can function properly.
6. Follow up processing and packaging
After passing all inspections and tests, the PCB processed by SMT surface mount still needs to undergo subsequent cleaning, coating with protective paint, and other treatments to increase its durability and reliability. Finally, package the processed PCB for transportation and storage.
