The inspection in SMT surface mount processing is a key link to ensure product quality and production efficiency, including visual inspection, X-ray inspection, infrared inspection, automated optical inspection, solder paste inspection, online testing, flying pin testing, etc.
1. Visual inspection
Visual inspection is one of the most fundamental and important inspection methods in SMT surface mount processing. With the help of a microscope or intelligent visual inspection system, visual inspection can ensure every detail on the PCB. This method can accurately capture assembly defects and welding errors, ensuring stable product quality.
2. X-ray testing
X-ray inspection can penetrate deep into the interior of circuit boards, providing insight into the quality of solder joints and the accuracy of component positions. It can quickly detect assembly defects and soldering errors without damaging the circuit board. This is particularly useful for components such as BGA (Ball Grid Array), as it can expose subtle soldering issues and defects at the bottom.
3. Infrared detection
Infrared detection is a thermal sensor in SMT surface mount processing, which can sensitively capture temperature changes and quality fluctuations during the soldering process. Through infrared scanning, welding errors and overheating phenomena can be quickly detected, providing strong support for taking timely measures for repair and adjustment.
4. Automated Optical Inspection (AOI)
With the intelligence of cameras and image processing software, precise inspection of component placement and solder joint quality is carried out. With its excellent detection capability and efficiency, it helps the production line sail towards the dual shore of efficiency and quality.
5. Solder Paste Inspection (SPI)
SPI conducts a meticulous review of the uniformity and correctness of solder paste. It ensures that the solder paste is accurately applied to the PCB, laying a solid foundation for subsequent soldering work.
6. Online Testing (ICT)
ICT conducts comprehensive and in-depth inspections of the connectivity of electronic components and circuits. It can detect weak signals of resistance, capacitance, and inductance, and promptly detect short circuits and open circuits.
7. Flying needle test
Flying needle testing uses automated detectors to shuttle between the complex wiring of PCBs, testing their connectivity and electrical performance. It is particularly suitable for small batch production or PCBs with complex wiring.
8. Functional testing
Functional testing comprehensively and rigorously assesses the performance of electronic products, ensuring that they meet specification requirements, including smooth and unobstructed functionality, communication, and interfaces.
9. Environmental testing
Environmental testing brings electronic products into various extreme environments, such as temperature cycling, humidity testing, vibration and shock, to evaluate their reliability and durability under various harsh conditions, ensuring their stable and reliable operation in various environments.
