PCBA process=SMT processing process+DIP processing process.
According to different production technologies, PCBA has various process flows, including single-sided mixed assembly process, single-sided DIP insertion process, single-sided SMT mounting process, single-sided mounting and double-sided mixed assembly process, double-sided SMT mounting process and insertion mixing process, and so on. There are certain process differences in different manufacturing processes. Below is a detailed explanation of each process:

1. Single sided DIP plugin
The PCB board that needs to be plugged in is first inserted with electronic components by production line workers, and then soldered by wave soldering. After the soldering is fixed, the board surface can be cleaned.
2. Single sided SMT mounting
Firstly, add solder paste to the component pad. After the PCB board completes solder paste printing, electronic materials are mounted through reflow soldering, and finally reflow soldering is performed.
3. Single sided mixed packaging
After solder paste printing on the PCB board, electronic components are mounted for reflow soldering. After quality inspection, DIP insertion is performed to complete wave soldering or manual soldering.

4. Mixed single-sided mounting and insertion
Some PCB boards are double-sided boards, with one side using mounting and the other side using insertion. The process of mounting and insertion is the same as single-sided processing, but when using reflow soldering and wave soldering, PCB boards require fixtures.
5. Double sided SMT mounting
Sometimes PCB board design engineers, in order to ensure the functionality and aesthetics of the PCB board, usually adopt double-sided mounting, with IC components arranged on one side and chip components mounted on the other side, maximizing the use of PCB board space and minimizing the PCB board area.
6. Double sided mixed packaging
There are two ways of double-sided mixing.
The first method of PCBA assembly requires three heating cycles, which is inefficient, and the use of red glue process for wave soldering has a low qualification rate. Therefore, it is not recommended to use it.
The second method is suitable for situations where there are more double-sided SMD components and fewer THT components, and it is recommended to use manual soldering.

The PCBA process is the process of processing an empty PCB into an electronic product that can be used by users.
Throughout the entire production process, many processes are interrelated, and any problem at any stage can have a significant impact on the quality of the product.