PCB high multilayer circuit board concentrates two major application areas
One is the plug-in printed circuit board and its motherboard or backplane in the large computer. With the widespread attention and application of computers in the fields of information processing such as aerospace, scientific research, and national defense, the speed of computers and the large-capacity of computers are rapidly required.
Generally speaking, high-multilayer pcb for large-scale computers are high-density and have complex structures such as buried blind holes and buried components, and the number of layers is between 20-60 layers.
The second type of application is the backplane in the main station such as communications or mobile phones. With the application of 5G networks and artificial intelligence, communications and mobile phones and their large-scale workstations have developed and expanded rapidly all over the world. Therefore, the backplanes for communications and mobile phones and large-scale workstations have obviously increased requirements. In general, the main feature of the backplane is that the number of layers is 17-40, the size is large, the thickness is thick, and the thickness is mostly 4-12mm.
In order to achieve high inter-layer alignment accuracy, high-level multi-layer circuit boards in the industry need to use PINLAM positioning method for production. Corresponding inner layer board punching machine, return line and PINLAM pressed steel plate. The positioning holes on the bottom cover plate of the press need to be precisely processed to meet the accuracy of the upper and lower alignment when PINLAM is pressed, which ultimately determines the interlayer alignment of the product.