When the PCB density increases by more than 8 layers, the HDI pcb cost will be lower than the traditional complex compaction process. The HDI board is conducive to the application of advanced construction technology. Its electrical performance and signal accuracy are higher than the traditional PCB. Interference, electromagnetic interference, electrostatic discharge, heat conduction and other aspects have been improved.
Electronic products continue to develop towards high density and high precision. The so-called “high” not only improves the performance of the machine, but also reduces the size of the machine. High-density integration (HDI) technology can make the final product design more compact, while meeting higher electronic performance and efficiency standards. At present, many popular electronic products, such as mobile phones, digital cameras, notebook computers, automotive electronics, etc., use HDI boards. With the upgrading of electronic products and market demand, the development of HDI boards will be very rapid.
Printed circuit board, abbreviated as printed circuit board, also known as printed circuit board, is an important electronic component, a support for electronic components, and a carrier for electrical connection of electronic components.
Its main function is that after the electronic equipment adopts the printed circuit board, due to the consistency of the same printed circuit board, the error of manual wiring is avoided, and the automatic insertion or installation of electronic components, automatic welding and automatic detection of electronic components are realized , To ensure the quality of electronic equipment, improve labor productivity, reduce costs and facilitate maintenance.
Are PCB boards with blind holes called HDI boards?
The HDI board is a high-density interconnection circuit board, and the blind hole secondary platen is an HDI board, divided into first-order, second-order, third-order, fourth-order, and fifth-order HDI.
A simple buried hole is not necessarily a human development index.
How to distinguish level 1, level 2 and level 3 of HDIPCB
The first order is relatively simple, and the process and process are easy to control.
The second order started to become troublesome, one was the alignment problem and the other was the drilling and copper plating problem. There are many second-order designs. One is that each order is wrong. When connecting the second adjacent layer, you need to connect it with wires in the middle layer, which is equivalent to two first-level HDI.
The second is that the two first-order holes overlap, the second-order coincides, the processing is similar to the first-order, but there are many key points that need special control, namely the above points.
The third is to punch directly from the outer layer to the third layer (or N≤2 layers). This process is much different from the positive, and it is more difficult to punch.
For the third order, the second order analogy is.
The difference between HDI board and ordinary PCB
The common PCB board is mainly FR-4 made of epoxy resin and electronic grade glass cloth. In general, traditional HDI should use adhesive-coated copper foil. Because laser drilling can not open the glass cloth, it is generally used without fiberglass adhesive copper foil, but now the high-energy laser drilling machine can break through 1180 glass cloth. In this way, it is no different from ordinary materials.