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What is the difference between SMT surface mount processing and DIP plug-in processing

Surface Mount Technology (SMT) and Dual In Line (DIP) plug-in technology have become two common assembly processes in electronic product manufacturing. Although they are both methods used to connect electronic components, there are significant differences in process flow, applicable scenarios, and characteristics.

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What industries are suitable for small batch SMT surface mount processing?

small batch SMT surface mount processing services are gradually becoming a favored choice for many industries. This service model is not only flexible and efficient, but also effectively reduces production costs and risks, making it particularly suitable for industries with customized and diversified needs for electronic products.

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How do the number of PCB layers affect the efficiency and quality of SMT processing?

The number of layers on a PCB (printed circuit board) has a significant impact on the efficiency and quality of SMT (surface mount technology) processing. Including the following factors: wiring density and processing difficulty, thermal conductivity and soldering quality, interlayer insulation and processing stability, design flexibility and manufacturing cost.

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multilayer PCB design

The difference between the inner and outer layers of PCB

There are differences in position, function, manufacturing, and cost between the inner and outer layers of PCB. The inner layer is responsible for electrical connections, which is complex and costly to manufacture; The outer layer is connected to the outside world, with simple manufacturing and low cost, but it needs to consider aesthetics and wear resistance.

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