Virtual soldering in SMT processing affects product quality, and it is necessary to optimize welding materials and processes, strengthen PCB board and component management, finely control each process, and strictly inspect and repair quality. Avoid virtual soldering and enhance product competitiveness.
How to avoid virtual soldering during SMT processing? Read More »
small batch SMT surface mount processing services are gradually becoming a favored choice for many industries. This service model is not only flexible and efficient, but also effectively reduces production costs and risks, making it particularly suitable for industries with customized and diversified needs for electronic products.
What industries are suitable for small batch SMT surface mount processing? Read More »
The number of layers on a PCB (printed circuit board) has a significant impact on the efficiency and quality of SMT (surface mount technology) processing. Including the following factors: wiring density and processing difficulty, thermal conductivity and soldering quality, interlayer insulation and processing stability, design flexibility and manufacturing cost.
How do the number of PCB layers affect the efficiency and quality of SMT processing? Read More »
There are differences in position, function, manufacturing, and cost between the inner and outer layers of PCB. The inner layer is responsible for electrical connections, which is complex and costly to manufacture; The outer layer is connected to the outside world, with simple manufacturing and low cost, but it needs to consider aesthetics and wear resistance.
The difference between the inner and outer layers of PCB Read More »
baking PCBs is to ensure that components can be reliably soldered to the PCB surface during SMT surface mount processing, improving product quality and reliability.
Why is it necessary to bake the PCB board before SMT mounting? Read More »
In the field of SMT processing, details determine success or failure. From material selection to environmental control, from equipment calibration to process optimization, to strict quality inspection, every step needs to be carefully planned and executed.
The details of SMT processing cannot be ignored Read More »
PCB coating with three proof paint can protect PCBs from harsh environmental erosion and extend the lifespan of electronic products,Its main function is to form a transparent protective film on the surface of the PCB, preventing external factors such as moisture, salt spray.
How to apply three proof paint on PCB? Read More »
In SMT technology, the stencil is a seemingly simple yet extremely critical component. It is a thin metal plate with holes precisely etched on it according to the PCB design, corresponding to the component pads.
The key role of steel mesh in SMT process Read More »
Lead free technology refers to the use of lead-free solder for soldering during PCBA processing, replacing traditional lead containing solder. This change is mainly driven by environmental regulations
Application of lead free technology in PCBA processing Read More »
burning refers to writing pre written program code into the memory on the PCBA board. This process enables the device to work according to the requirements of the program and achieve the expected functions.
Burning process in PCBA processing Read More »
The PCB surface mount processing technology covers raw material preparation, PCB board making, SMT surface mount, DIP packaging, BGA packaging, and subsequent processing and testing. Each link is related to product performance and quality.
Detailed explanation of PCB surface mount processing technology from SMT to BGA Read More »
Cleaning is crucial in PCBA OEM material processing, as it can remove surface dirt and residues, enhance insulation performance, improve corrosion resistance and appearance quality。
Why do we need to clean PCBA after processing Read More »
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