Blind And Buried vias pcb
6 layers HDI blind and buried board FR4 TG 170 impedance control board of custom HDI board prototype
| Layer | 6 | Material | FR4 TG170 |
| Thickness | 0.060″ | Min.line width and space | 5/5mil |
| Min.Hole size | 8mil | Surface Finish | ENIG |
| Copper Thickness: | 1 oz | Impedance control | Yes |
| Via filled | Fill copper | ||
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