The minimum device package is 0201. It also has the device mounting of CSP package with a ball pitch of 0.35mm and QFN, which are of higher difficulty.
The minimum device package is 0201. It also has the device mounting of CSP package with a ball pitch of 0.35mm and QFN, which are of higher difficulty. Through the trial production, the expansion and contraction ratio of the flexible board was calculated to adjust the optimal furnace temperature, ensuring that the shape of the flexible board had no expansion and contraction after mounting, improving the mounting accuracy, and finally achieving a perfect delivery.
