HDI PCB Manufacturing high density interconnect
10 Layer Quad Stacked HDI Quad Lamination with ENIG Ultra Thick 3.2mm Board PCB Board Manufacturer.
| Layer： | 10-layers PCB(with Blind & Buried Micro-Vias: L1-L2、L1-L3、L1-L4、L1-L5、L1-L6、L1-L7、L1-L8、L1-L9） | ||
| Material： | FR4 G170 | Thickness ： | 3.2mm |
| Copper thickness： | 35μm | Surfacefinish : | ENIG |
| Soldermask/Legend | Green/White | IPC Standard | IPC2 |
| Unit size： | 203*178mm | Filled vias: | With resin |
For quotation, please contact James:+86- 18011866680
Send you gerber file to Email: sales@fastturnpcbs.com
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