high density interconnect pcb with blind vias
10 layer two stacked HDI three times laminations with selective hard gold fine circuit PCB Board Manufacturer
| Layer： | 10-layers PCB(with Blind & Buried Micro-Vias:L1-2;L2-3；L3-8；L8-9；L9-10 ) | ||
| Material： | FR4 TG170 | Thickness： | 1.6mm±10% |
| Copper thickness： | 18/35μm | Surface finish： | Slective 30μ” Hard Gold + ENIG |
| Track Width&Gap | 3/3mil | Soldermask/Legend | Green/White |
| IPC Standard： | IPC3 | Unit size： | 86x43mm |
| Array size： | 86x43mm(1-up) | Minimum hole copper： | 25μm |
For quotation, please contact James:+86- 18011866680
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