In the PCB process, if there is tin connection, especially during manual soldering, the following steps can be taken to ensure that the quality and performance of the circuit board are not affected. The following is a clear processing flow:
1、 Preparation work
Tool preparation: Ensure that necessary tools and materials such as a hot air gun, soldering iron, suction wire (or suction pump), stripping knife (or stripper), sponge, flux, etc. are at hand.
Safety inspection: Ensure good ventilation in the work area, wear protective equipment such as gloves, goggles, etc. to prevent burns or inhalation of harmful gases.
2、 Processing steps
Identify the position of tin connection
Carefully observe the circuit board and accurately identify the specific location of the solder connection. This helps with subsequent precise processing and avoids unnecessary damage to surrounding components.
Heating soldering
Use a soldering iron or hot air gun: Select the appropriate tool for heating based on the severity and location of the solder connection. For smaller solder joints, a soldering iron can be used; For larger tin areas, it is recommended to use a hot air gun.
Temperature control: Adjust the temperature of the soldering iron or hot air gun to the appropriate range (generally, the temperature of the soldering iron head is about 350 ° C, and the temperature of the hot air gun also needs to be adjusted accordingly) to avoid overheating and damage to the circuit board or components.
Separate tin connection
Using a solder wire or pump: After the solder melts, quickly use a solder wire or pump to remove the melted solder and separate the solder connection points. Pay attention to maintaining quick and stable movements to avoid solder spatter.
Use a stripping knife or stripper: If the tin connection is stubborn, you can use a stripping knife or stripper to carefully scrape it off. Keep your hands stable when scraping to avoid scratching the circuit board or components.
Cleaning and inspection
Using a sponge to wipe the soldering iron head: Keeping the soldering iron head clean helps improve welding quality.
Check the circuit board: After handling the soldering, carefully inspect the circuit board to ensure that all solder joints are clear and there are no short circuits. If necessary, a multimeter can be used for testing.
3、 Precautions
Avoid overheating: Strictly control the temperature and time during the heating process to avoid damage to the circuit board or components caused by overheating.
Be careful when handling solder connections: Keep your hands steady and careful to avoid unnecessary damage to the circuit board or components.
Using appropriate flux: Moderate use of flux during the welding process can improve welding performance, but excessive use can affect welding quality and may corrode circuit boards. Therefore, it is necessary to control the amount of flux used.
Seeking professional help: If the tin connection problem is complex or cannot be solved by oneself, it is recommended to seek the help of professionals such as electronic engineers or welding technicians.
The above steps and precautions can effectively handle the tin connection problem that occurs in the PCB process to ensure that the quality and performance of the circuit board are not affected.
