PCB Capability Technology rigid plate process capability parameter table
| Item Name | Technical Capability Parameter | |
| Material Type | Ordinary Tg FR4 | Biofine S1141&KB (not recommended for lead-free soldering process) |
| Ordinary Tg FR4 (halogen free) | Sheng Yi S1155 | |
| High Tg FR4 (halogen free) | Bio-gain S1155 | |
| Material type used for HDI board | LDPP (IT-180A 1037 and 1086), normal 106 and 1080 | |
| High CTI | Bio-gain S1600 | |
| High Tg FR4 | Isola: FR408, FR408HR, IS410, PCL-370HR; Lian Mao: IT-180A, IT-150DA; Nelco: N4000-13, N4000-13EP, N4000-13SI, N4000-13EP SI; Panasonic:R-5775K (Megtron6) R- 5725 (Megtron4) Taiyao:TU-768, TU-662; Tengfei:VT-47. | |
| Ceramic powder filled high frequency materials | Rogers：Rogers4350、Rogers4003 | |
| Material mixing and pressing | Rogers, Nelco and FR-4 | |
| Product Type | Rigid boards | Backplane, HDI, Multilayer Buried Blind Hole, Buried Capacitor, Buried Resistor, Thick Copper, Power Thick Copper, Semiconductor Test Board |
| Stacking method | Multiple press-fit blind buried hole board | Same side press-fit ≤3 |
| HDI board type | 1+n+1, 1+1+n+1+1, 2+n+2, 3+n+3 (buried holes in n ≤ 0.3mm), laser blind holes can be plated to fill holes | |
| Surface treatment | Surface treatment type (lead-free) | Electroplated cupro-nickel gold, submerged gold, hard gold plating (with/without nickel), gold finger plating, lead-free tin spraying, OSP, chemical nickel-palladium gold, soft gold plating (with/without nickel), submerged silver, submerged tin, ENIG+OSP, ENIG+G/F, full plate gold plating+G/F, submerged silver+G/F, submerged tin+G/F |
| Surface treatment type (leaded) | Tin spray with lead | |
| Thickness to diameter ratio | 10 1 (leaded/leadless sprayed tin chemically immersed nickel gold immersed silver immersed tin chemically immersed nickel palladium gold) 8 1 (OSP) | |
| Processed Size (MAX) | Leaded sprayed tin | |
| Surface treatment type (with lead) | Leaded tin spray 22"*39"; lead-free tin spray 22"*24"; gold finger plated 24"*24"; hard gold plated 24"*28"; chemically deposited gold 21"*27"; graphically plated copper-nickel-gold 21"*48"; deposited tin 16"*21"; deposited silver 16"*18"; OSP 24"*40"; | |
| Processing Size (MIN) | Leaded tin 5"*6"; lead-free tin 10"*10"; gold finger 12"*16"; hard gold 3"*3"; copper-nickel gold 8"*10"; sunken tin 2"*4"; sunken silver 2"*4"; OSP 2"*2"; | |
| Processing plate thickness | Leaded tin spray 0.6-4.0mm; lead-free tin spray 0.6-4.0mm; gold finger plating 1.0-3.2mm; hard gold plating 0.1-5.0mm; chemical gold plating 0.2-7.0mm; graphical copper-nickel gold plating 0.15-5.0mm; submerged tin 0.4-5.0mm; submerged silver 0.4-5.0mm; OSP 0.2-6.0mm; | |
| Golden finger height max | 1.5inch | |
| Minimum spacing between gold fingers | 6mil | |
| Minimum Segment Spacing Between Segmented Gold Fingers | 7.5mil | |
| Surface plating (overlay) thickness | Tin spraying | 2-40um (0.4um for large tin surface with leaded spray tin, 1.5um for large tin surface with lead-free spray tin) |
| OSP | Film thickness: 0.2-0.6um | |
| Chemically immersed nickel gold | Gold thickness 0.05-0.10um, nickel thickness 3-8um | |
| Chemical silver deposition | Silver thickness 0.2-0.4um | |
| Chemically immersed tin | Tin thickness ≥1.0 | |
| Hard gold plating | Gold thickness 0.10-1.5um (dry film patterning process), gold thickness 0.10-4.0um (non-dry film patterning process) | |
| Soft gold plating | Gold thickness 0.10-1.5um (dry film plating process), gold thickness 0.10-4.0um (non-dry film plating process) | |
| Chemical nickel-palladium gold | Gold 0.05-0.10um thick, nickel 3-8um thick, palladium 0.05-0.15um thick | |
| Plating copper-nickel-gold | Gold thickness 0.025-0.10um, nickel thickness ≥3um, base copper thickness max 1OZ | |
| Gold finger nickel gold plating | Gold thickness 0.25-1.5um (required value refers to the thinnest point), nickel thickness ≥3um | |
| Carbon oil | 0.1-0.35mm | |
| Green oil | Copper surface cover oil (10-18um), over-hole cover oil (5-8um), line corners ≥5um (once printed, copper thickness below 48um) | |
| Blue glue | 0.20-0.80mm | |
| Drilling | 0.1/0.15/0.2mm maximum plate thickness for mechanical drilling | 0.8mm/1.5mm/2.5mm |
| Laser drilled holes min | 0.1mm | |
| Laser drilled hole diameter max | 0.15mm | |
| Machine hole diameter (finished) | 0.15-6.2mm (corresponds to drill cutter 0.2-6.3mm) | |
| Minimum finished hole diameter of PTFE material (including mixed pressure) plate 0.25mm (corresponds to drilling tool 0.35mm) | ||
| Mechanically buried blind hole aperture ≤ 0.3mm (corresponds to drill cutter 0.4mm) | ||
| Drilling diameter of green oil plug hole in disk ≤ 0.45mm (corresponding to drilling tool 0.55mm) | ||
| Continuous hole bore diameter minimum 0.35mm (corresponding to drill cutter 0.45mm) | ||
| Metallized half-hole bore diameter 0.30mm minimum (corresponds to 0.4mm for drill cutter) | ||
| Through-hole plate thickness to diameter ratio max | 20:1 (excluding ≤0.2mm cutter diameter; >12:1 to be evaluated) | |
| Laser drilling depth to bore ratio max | 1：1 | |
| Mechanically controlled deep drilling blind hole depth hole diameter ratio max | 1.3:1 (hole diameter ≤ 0.20mm),1.15:1 (hole diameter ≥ 0.25mm) | |
| Mechanically controlled deep drilling (back drilling) depth minimum | 0.2mm | |
| Drilling-Minimum distance from mechanical drill hole to conductor (non-buried blind plate and first order laser blind hole) | 5.5 mil (≤8 layers); 6.5 mil (10-14); 7 mil (>14 layers) | |
| Drilling - minimum distance from mechanical drill hole to conductor (mechanical buried blind hole plate and second order laser buried blind hole) | 7 mil (primary press fit); 8 mil (secondary press fit); 9 mil (tertiary press fit) | |
| Drilling - minimum distance from mechanical drilling to conductor (blind laser buried holes) | 7mil（1+N+1）；8mil（1+1+N+1+1或2+N+2） | |
| Drilling - laser drilling to conductor minimum body distance (1st and 2nd order HDI boards) | 5mil | |
| Drilling-minimum distance between different network hole walls (after compensation) | 10mil | |
| Drilling - minimum distance between hole walls of the same network (after compensation) | 6 mil (through hole; laser blind hole); 10 mil (mechanical blind buried hole) | |
| Minimum distance between drill hole-non-metallic hole walls (after compensation) | 8mil | |
| Drill hole-hole tolerance (compared to CAD data) | ±2mil | |
| Drill-NPTH hole bore tolerance min | ±2mil | |
| Drill-NPTH Hole Hole Diameter Accuracy | ±2mil | |
| Drill-Tapered Hole Depth Tolerance | ±0.15mm | |
| Drill-Tapered Hole Diameter Tolerance | ±0.15mm | |
| Pads (rings) | Laser hole inner and outer pad size minimum | 10 mil (4 mil laser hole), 11 mil (5 mil laser hole) |
| Minimal size of inner and outer pads for mechanical vias | 16 mil (8 mil hole size) | |
| BGA pad diameter minimum | 10mil for leaded solder spray process, 12mil for lead-free solder spray process, 7mil for other processes | |
| Pad Tolerance (BGA) | +/-1.2mil (pads <12mil); +/-10% (pads ≥12mil) | |
| Wire width/spacing | inner layer | 1/2OZ：3/3mil |
| 1OZ: 3/4mil | ||
| 2OZ: 4/5mil | ||
| 3OZ: 5/8mil | ||
| 4OZ: 6/11mil | ||
| 5OZ: 7/13.5mil | ||
| 6OZ: 8/15mil | ||
| 7OZ: 9/18mil | ||
| 8OZ: 10/21mil | ||
| 9OZ: 11/24mil | ||
| 10OZ: 12/27mil | ||
| Outer layer | 1/3OZ-based copper: 3/3 mil | |
| 1/2OZ-based copper: 3.5/3.5 mil | ||
| 1OZ-based copper: 4.5/5 mil | ||
| 1.43OZ-based copper (positive):4.5/6 | ||
| 1.43OZ-based copper (negative):5/7 | ||
| 2OZ-based copper: 6/7 mil | ||
| 3OZ-based copper: 6/10 mil | ||
| 4OZ-based copper: 7.5/13mil | ||
| 5OZ-based copper: 9/16mil | ||
| 6OZ-based copper: 10/19mil | ||
| 7OZ-based copper: 11/22mil | ||
| 8OZ-based copper: 12/26mil | ||
| 9OZ-based copper: 13/30mil | ||
| 10OZ-based copper: 14/35mil | ||
| Line Width Tolerance | ≤10mil：+/-1.0mil | |
| ＞10mil：+/-1.5mil | ||
| Solder resist character | Maximum hole diameter for solder resist plug holes (both sides covered with oil) | 0.9mm |
| Solder resist ink color | Green, yellow, black, blue, red, white, purple, green matte | |
| Character Ink Colors | white, yellow, black | |
| Maximum diameter of blue rubber aluminum plug hole | 5mm | |
| Resin plug hole drilling hole diameter range | 0.1-1.0mm | |
| Maximum thickness to diameter ratio of resin plug hole | 10：1 | |
| Solder resist character - minimum width of solder resist bridge | Base copper ≤ 0.5 OZ, surface treatment with sunken tin: 7.5 (black), 5.5 (other colors), 8.0 (solder resist bridge on large copper surface) | |
| Base copper ≤ 0.5 OZ, other surface finishes other than sunken tin: 5.5 (black, limit 5), 4 (other colors, limit 3.5), 8.0 (large copper surface solder resist bridge) | ||
| Base copper 1OZ: 4 (green), 5 (other colors), 5.5 (black, limit 5), 8.0 (solder resist bridge on large copper surface) | ||
| Base copper 1.43oz: 4 (green), 5.5 (other colors), 6 (black), 8.0 (solder resist bridge on large copper surface) | ||
| Base Copper 2-4OZ: 6, 8 (solder resist bridge on large copper surface) | ||
| Profile | Distance from the centerline of the V-CUT without copper leakage to the graph | H≤1.0mm: 0.3mm (20° refers to V-CUT angle), 0.33mm (30°), 0.37mm (45°); |
| 1.0 < H≤1.6mm:0.36mm(20°)、0.4mm(30°)、0.5mm(45°); | ||
| 1.6 < H≤2.4mm:0.42mm(20°)、0.51mm(30°)、0.64mm(45°); | ||
| 2.4＜H≤3.2mm:0.47mm(20°)、0.59mm(30°)、0.77mm(45°); | ||
| V-CUT symmetry tolerance | ±4mil | |
| Maximum number of V-CUT lines | 100 articles | |
| V-CUT angular tolerance | ±5 degrees | |
| Chemical nickel V-CUT angle specification palladium | 20、30、45degrees | |
| Golden finger chamfer angle | 20、30、45、60degrees | |
| Golden finger chamfering angle tolerance | ±5 degrees | |
| >Minimum distance of TAB without chamfering next to the gold finger | 6mm | |
| Minimum distance between the side of the gold finger and the edge line of the form | 8mil | |
| Controlled depth milling groove (edge) depth accuracy (NPTH) | ±0.10mm | |
| Outline dimensional accuracy (edge-to-edge) | ±4mil | |
| Minimum tolerance (PTH) for milled slot slot hole | ±0.13mm in both slot width and slot length direction | |
| Minimum tolerance (NPTH) for milling slotted holes | ±0.10mm in both slot width and slot length direction | |
| Minimum tolerance for drilling slotted holes (PTH) | Slot width direction ±0.075mm; Slot length/slot width <2:Slot length direction +/-0.1mm; Slot length/slot width ≥2:Slot length direction +/-0.075m | |
| Minimum tolerance for drilling slotted holes (NPTH) | ±0.075mm in slot width direction; slot length/slot width <2:slot length direction +/-0.1mm; slot length/slot width ≥2:slot length direction +/-0.075m | |
| Partial mixing pressure | Minimum distance from drill hole to conductor in area of partial mixing pressure | 12 (local 10) mil |
| Minimum distance from the junction of the local mixing pressure to the drill hole | 10mil | |
| Metal substrate | Number of layers | Aluminum substrate, copper substrate: 1-8 layers; |
| Finished product size (aluminum substrate, copper substrate, cold plate, sintered plate, buried metal plate) | MAX:610*610mm、MIN:5*5mm | |
| Production size maximum (ceramic plate) | 100*100mm | |
| Finished plate thickness | 0.5-5.0mm | |
| Copper thickness | 0.5-10 OZ | |
| Metal base thickness | 0.5-4.5mm | |
| Metal base material | AL: 1100/1050/2124/5052/6061; Copper: Purple copper pure iron | |
| Minimum finished bore diameter and tolerance | NPTH: 0.5±0.05mm; PTH (aluminum substrate, copper substrate): 1.0±0.1mm; PTH (cold plate, sintered plate, buried metal plate): 0.2±0.10mm; | |
| Profile machining accuracy | ±0.03mm | |
| PCB part surface treatment process | Leaded/lead-free tin spraying; OSP; sunken nickel (palladium) gold; electric (nickel) soft/hard gold; electroplated tin; nickel-free electroplated soft/hard gold; thick gold fabrication | |
| Metal surface treatment | Copper: nickel gold plating; aluminum: anodizing, hard oxidizing, chemical passivation; mechanical treatment: dry sandblasting, brushing | |
| Metal base material | All-Power Aluminum Substrate (T-110, T-111); Tengai Aluminum Substrate (VT-4A1, VT-4A2, VT-4A3); Laird Aluminum Substrate (1KA04, 1KA06); Beggs Metal Substrate (MP06503, HT04503); TACONIC Metal Substrate (TLY-5, TLY-5F); | |
| Thickness of thermally conductive adhesive (dielectric layer) | 75-150um | |
| Buried copper block size | 3*3mm—70*80mm | |
| Buried copper block flatness (drop accuracy) | ±40um | |
| Buried copper block to hole wall distance | ≥12mil | |
| Thermal conductivity | 0.3-3W/m.k (aluminum substrate, copper substrate, cold plate); 8.33W/m.k (sintered plate); 0.35-30W/m.k (buried metal plate); 24-180W/m.k (ceramic plate); | |
| Other | Finished copper thickness max | 12 inner layer: 10 OZ; outer layer: 11 OZ |
| Finished copper thickness of outer layer | 12, 18um base copper: ≥35.8 (reference: 35.8-42.5); ≥40.4 (reference: 40.4-48.5) | |
| 35, 50, 70um base copper: ≥55.9; ≥70; ≥86.7 | ||
| 105, 140um base copper: ≥117.6; ≥148.5 | ||
| Circuit Board Layer Count | 1-40 layers | |
| Finished board thickness | 0.20-7.0mm (without solder resist); 0.40-7.0mm (with solder resist); | |
| Plate thickness tolerance (conventional) | Plate thickness ±10% (>1.0mm); ±0.1mm (≤1.0mm); | |
| Plate thickness tolerance (special) | Plate thickness ±0.1mm (≤2.0mm); ±0.15mm (2.1-3.0mm) | |
| Finished size min | 10*10mm (without internal positioning splice design; up to 50*50 splice) | |
| Maximum finished size | 23*35inch (double-sided); 22.5*33.5inch (four-ply); 22.5*30 (≥six-ply); | |
| Ionic contamination | ≤1ug/cm2 | |
| Warp Limit Capability | 0.1% (This capability requires consistent stacked sheet type, strict symmetry in the stack, a residual copper rate difference of 10% or less in the symmetrical layer, uniform wiring, no concentrated large copper skins or substrates, no glossy or veneer panels in the stack, and a sputter size of ≤ 21 inches on the long side;)< | |
| Impedance tolerance | ±5Ω( <50Ω),±10%(≥50Ω)； | |
| plating fill laser blind hole aperture | 4-5 mil (4 mil preferred) | |
| Plating filler blind hole with maximum hole depth to hole diameter ratio | 1:1 (depth is the thickness of contained copper) | |
