BGA soldering is a technically demanding and operationally complex process that requires strict adherence to process specifications and operating guidelines to ensure soldering quality and reliability of electronic products.
Detailed steps and operation guide for BGA soldering Read More »
Checking and avoiding PCB short circuits requires comprehensive consideration of multiple aspects such as design, manufacturing, testing, and quality control.
Optimizing PCB Circuit Board Design:，Checking and Preventing Short Circuits Read More »
PCBA one-stop service refers to entrusting the entire PCBA process, including design, procurement, processing, testing, etc., to a professional PCBA manufacturer
Seven core advantages of PCBA one-stop service Read More »
the coordination between SMT surface mount processing and PCB design is the key to achieving efficient and high-quality electronic manufacturing. By strengthening communication and collaboration between the two, continuously optimizing design schemes and processing flows
How to coordinate SMT surface mount processing with PCB design Read More »
The performance and reliability of a circuit board largely depend on the selected substrate, which not only carries circuit components but also provides electrical insulation, mechanical support, and thermal management functions.
Selection criteria for circuit board substrates Read More »
10 details to pay attention to when designing PCB, including spacing between components, arrangement of decoupling capacitors, serpentine routing design, heat dissipation of specific area solder pads, and heat dissipation of specific area solder pads
Don’t ignore these 11 details when designing PCB! Read More »
As an advanced PCB surface treatment process, the immersion gold process can significantly improve the soldering performance, corrosion resistance, and conductivity of PCBs, making it an essential process for electronic manufacturing.
The role of PCB IMMERSION GOLD process Read More »
SMT and DIP are two important electronic component installation methods, each with unique characteristics and application scenarios. When choosing which technology to use, it is necessary to comprehensively consider factors such as specific application requirements, production costs, and production efficiency.
Differences in Characteristics and Applications between SMT and DIP Read More »
In the SMT surface mount processing, material loss is an issue that cannot be ignored. It not only relates to the control of production costs, but also directly affects the economic benefits and market competitiveness of enterprises.
Reasons and optimization strategies for material loss in SMT surface mount processing Read More »
When choosing PCB hard board and FPC soft board, multiple factors need to be considered, including application requirements, performance characteristics, cost budget, and production process.
PCB hard board and FPC soft board: how to make the best choice according to needs Read More »
In the process of PCBA surface mount processing, although we strive for perfection, it is inevitable to encounter some processing defects. Understanding these common defects is crucial for improving production quality and efficiency.
Possible defects encountered during PCBA processing. Read More »
In SMT (Surface Mount Technology) programming, there are various commonly used software with different characteristics and functions. The following are some of the main SMT programming software:
What are the commonly used SMT programming software Read More »
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