The size of the entire board is > 250*250mm. It adopts the inter FBGA processor with the minimum ball pitch of 0.35mm, the Micron memory of FBGA with the ball pitch of 0.4mm, and multiple FPC interfaces with high-density pins
The size of the entire board is > 250*250mm. It adopts the inter FBGA processor with the minimum ball pitch of 0.35mm, the Micron memory of FBGA with the ball pitch of 0.4mm, and multiple FPC interfaces with high-density pins. The use of a 12-temperaturezone nitrogen reflow soldering perfectly ensures the soldering qualityof the precise and difficult devices of this board.
