NEWS
What are the reliability tests for PCB boards?
The reliability testing of PCB boards is a complex and rigorous process, covering multiple aspects such as soldering quality, functionality, environmental adaptability, and specialized testing.
PCB design should pay attention to spacing data
PCB design should pay attention to spacing data: 1. Spacing between wires; 2. Pad aperture and pad width; 3. The spacing between solder pads; 4. The distance between the copper sheet and the edge of the board.
The limitations of online quotation in SMT surface mount processing
SMT surface mount processing is difficult to quote online due to complexity, customization requirements, and cost efficiency considerations. Offline quotation and communication can better meet the needs, ensure the smooth progress of the project, and maintain long-term cooperative relationships.
SMT production line workflow and technical advantages
The basic process of SMT production line includes PCB mounting, solder paste printing, SMD mounting, reflow soldering, plug-in soldering, wave soldering, AOI inspection, and final offline and packaging.
Classification and Application of Solder Paste in SMT
There are various classifications of solder paste performance in SMT processing, including melting point, flux activity, viscosity, cleaning method, lead content, and tin powder particle size. Choosing the appropriate solder paste is crucial for welding quality and production efficiency.
How many layers are there on a PCB board?
PCB boards can be divided into single panel, double-sided board, and multi-layer board. Different types of PCB boards are suitable for different types of circuits and have different manufacturing processes and characteristics.
How to control the cost of SMT surface mount production?
In the production process of SMT patches, cost control involves multiple aspects, including material costs, equipment maintenance, production efficiency, quality management, etc.
Analysis of PCBA Process Flow
According to different production technologies, PCBA has various process flows, including single-sided mixed assembly process, single-sided DIP insertion process, single-sided SMT mounting process, single-sided mounting and double-sided mixed assembly process, double-sided SMT mounting process and insertion mixing process, and so on.
What is the difference between PCB gold deposition and tin deposition processes
In the PCB manufacturing process, surface treatment technology is particularly critical, among which gold deposition and tin deposition are two common processing methods, each with unique advantages and application scenarios.
What are the main equipment of SMT production line
SMT surface mount technology is a new generation of electronic assembly technology that evolved from hybrid integrated circuit technology. It takes surface mount technology and reflow soldering technology as its core, greatly promoting the miniaturization and multifunctionality of electronic products.
Reasons for PCB soldering defects
Reasons for PCB soldering defects: 1. The solderability of circuit board holes affects the soldering quality; 2. The composition of the solder and the properties of the solder material being used; 3. Welding temperature and cleanliness of metal plate surface; 4. Welding defects caused by warping; The design of the circuit board affects the quality of soldering.
How to choose between PCB hard board and FPC soft board?
In summary, the selection of PCB hard board and FPC soft board should comprehensively consider factors such as application scenarios and requirements, product design and layout requirements, cost and production cycle, reliability and maintenance costs, as well as technology and manufacturing processes.
