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Reasons for Welding Cracks in SMT Surface mount Processing

To reduce the risk of welding cracks, it is necessary to adopt good process control and quality control measures in SMT processing, including correct selection of solder, optimization of welding temperature and cycle, consideration of component layout and material selection, and regular quality inspection and testing. This helps to improve the reliability of welding and reduce the occurrence of welding cracks.

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How long does it take to make PCBA samples?

The sample production cycle of PCBA is affected by factors such as design complexity, number of board layers, processing plant capacity, component procurement, and order volume. The sampling time ranges from several days to several weeks, and it is necessary to comprehensively consider each link and communicate with the processing plant to ensure timely delivery.

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How to avoid virtual soldering during SMT processing?

Virtual soldering in SMT processing affects product quality, and it is necessary to optimize welding materials and processes, strengthen PCB board and component management, finely control each process, and strictly inspect and repair quality. Avoid virtual soldering and enhance product competitiveness.

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