PCB Technology Roadmap,PCB production technology upgrade-Fast turn PCB

Technology Roadmap

	2018		2019		2020
Minimum line width/spacing	Mass Production	Prototype	Mass Production	Prototype	Mass Production	Prototype
Maximum number of floors	24	30	26	34	26	36
Minimum board thickness	0.3	0.2	0.3	0.2	0.3	0.2
Minimum copper cladding thickness	0.05	0.05	0.05	0.05	0.05	0.05
Minimum laser hole	0.1	0.1	0.1	0.1	0.1	0.1
Maximum board thickness to hole ratio	16:01:00	18:01:00	18:01:00	20:01:00	20:01:00	22:01:00
Minimum over-hole	0.15	0.1	0.15	0.1	0.1	0.1
Impedance Control	±7	±7	±7	±5	±7	±5
RoHs Certification	Have	Have	Have	Have	Have	Have
Lead-free process	Have	Have	Have	Have	Have	Have
Green Materials	Have	Have	Have	Have	Have	Have
Copper-filled microporous	Have	Have	Have	Have	Have	Have
HDI Structure	1+N+1	2+N+2	2+N+2	3+N+3	2+N+2	4+N+4
ELIC grade	10 layer	12 layer	12 layer	14 layer	14 layer	14 layer