| | 2018 | 2019 | 2020 |
| Minimum line width/spacing | Mass Production | Prototype | Mass Production | Prototype | Mass Production | Prototype |
| Maximum number of floors | 24 | 30 | 26 | 34 | 26 | 36 |
| Minimum board thickness | 0.3 | 0.2 | 0.3 | 0.2 | 0.3 | 0.2 |
| Minimum copper cladding thickness | 0.05 | 0.05 | 0.05 | 0.05 | 0.05 | 0.05 |
| Minimum laser hole | 0.1 | 0.1 | 0.1 | 0.1 | 0.1 | 0.1 |
| Maximum board thickness to hole ratio | 16:01:00 | 18:01:00 | 18:01:00 | 20:01:00 | 20:01:00 | 22:01:00 |
| Minimum over-hole | 0.15 | 0.1 | 0.15 | 0.1 | 0.1 | 0.1 |
| Impedance Control | ±7 | ±7 | ±7 | ±5 | ±7 | ±5 |
| RoHs Certification | Have | Have | Have | Have | Have | Have |
| Lead-free process | Have | Have | Have | Have | Have | Have |
| Green Materials | Have | Have | Have | Have | Have | Have |
| Copper-filled microporous | Have | Have | Have | Have | Have | Have |
| HDI Structure | 1+N+1 | 2+N+2 | 2+N+2 | 3+N+3 | 2+N+2 | 4+N+4 |
| ELIC grade | 10 layer | 12 layer | 12 layer | 14 layer | 14 layer | 14 layer |
