Technology Goad

Technology Goad

Technology Roadmap
201820192020
Minimum line width / spaceMass productionProofingMass productionProofingMass productionProofing
Maximum number of layers243026342636
Minimum plate thickness0.30.20.30.20.30.2
Minimum copper thickness0.050.050.050.050.050.05
Minimum laser hole0.10.10.10.10.10.1
Maximum plate thickness aperture ratio16:01:0018:01:0018:01:0020:01:0020:01:0022:01:00
Minimum via0.150.10.150.10.10.1
Impedance control±7±7±7±5±7±5
RoHs certificationhavehavehavehavehavehave
Lead-free processhavehavehavehavehavehave
Green material-H/Fhavehavehavehavehavehave
Copper-filled microviahavehavehavehavehavehave
HDI structure1+N+12+N+22+N+23+N+32+N+24+N+4
ELIC level10Floor12Floor12Floor14Floor14Floor14Floor