SMT surface mount technology is a new generation of electronic assembly technology that evolved from hybrid integrated circuit technology. It focuses on component surface mount technology and reflow soldering technology, greatly promoting the miniaturization and multifunctionality of electronic products. The SMT production line achieves high-speed and precise placement and soldering of electronic components on PCBs through a series of precision equipment collaborative operations, providing a solid guarantee for mass production and low defect rate production.

The basic process of SMT production line includes PCB mounting, solder paste printing, SMD mounting, reflow soldering, plug-in soldering, wave soldering, AOI inspection, and final offline and packaging. The entire process is highly automated, and each process is closely connected, forming an efficient and collaborative production system.

The technical advantages of SMT production lines include:
High assembly density: After adopting SMT technology, the volume and weight of electronic products are significantly reduced, and the assembly density is greatly increased.
High reliability: SMT soldering has a low defect rate and strong anti vibration ability, which improves the reliability and stability of electronic products.
High production efficiency: The highly automated production line significantly improves production efficiency and reduces labor costs.
Cost reduction: The application of SMT technology helps to save materials, energy, and equipment investment, reducing overall production costs.