SMT and DIP are two important electronic component installation methods, each with unique characteristics and application scenarios. When choosing which technology to use, it is necessary to comprehensively consider factors such as specific application requirements, production costs, and production efficiency.
Differences in Characteristics and Applications between SMT and DIP Read More »
In the field of SMT surface mount processing, small batch sampling orders and small batch production orders are two common production modes. Although they all involve SMT surface mount processing, there are significant differences in purpose, process, cost control, and flexibility.
As the core component of industrial automation control, the manufacturing process of industrial control boards has extremely high requirements for accuracy and reliability. The following will explore in depth from the aspects of component preparation, printing and board making, mounting, welding, testing, and subsequent processing.
What are the SMT process requirements for industrial control boards? Read More »
The lead time for PCBA sampling is the result of a combination of multiple factors. From PCB production to component procurement, to SMT/DIP processing and testing, every step may have an impact on the overall processing cycle.
How long does it take for PCBA sample delivery? Read More »
The RoHS standard restricts the use of harmful substances in electronic and electrical equipment, and the requirements for SMT include changes in solder, selection of PCB materials, process adjustments, and increased environmental requirements.
RoHS standard requirements for SMT Read More »
SMT has put forward various requirements for circuit board design, and meeting these requirements will help improve the efficiency and yield of SMT SMT, reduce production costs, improve product quality and reliability, and promote the sustainable development of the electronic manufacturing industry.
Requirements of SMT for Circuit Board Design Read More »
SMT surface mount processing is difficult to quote online due to complexity, customization requirements, and cost efficiency considerations. Offline quotation and communication can better meet the needs, ensure the smooth progress of the project, and maintain long-term cooperative relationships.
The limitations of online quotation in SMT surface mount processing Read More »
The basic process of SMT production line includes PCB mounting, solder paste printing, SMD mounting, reflow soldering, plug-in soldering, wave soldering, AOI inspection, and final offline and packaging.
SMT production line workflow and technical advantages Read More »
There are various classifications of solder paste performance in SMT processing, including melting point, flux activity, viscosity, cleaning method, lead content, and tin powder particle size. Choosing the appropriate solder paste is crucial for welding quality and production efficiency.
Classification and Application of Solder Paste in SMT Read More »
SMT surface mount technology is a new generation of electronic assembly technology that evolved from hybrid integrated circuit technology. It takes surface mount technology and reflow soldering technology as its core, greatly promoting the miniaturization and multifunctionality of electronic products.
What are the main equipment of SMT production line Read More »
SMT surface mount processing is a key technology in electronic manufacturing, involving steps such as PCB production, component preparation, steel mesh printing, mounting, reflow soldering, quality inspection, cleaning and post-processing, and finished product testing.
The key steps of SMT surface mount Read More »
SMT surface mount processing technology is widely used in the production and processing of various electronic components due to its advantages of high efficiency, precision, and low cost. From resistors, capacitors, inductors to diodes, transistors, and integrated circuits, almost all common types of electronic components are covered.
Which electronic components are suitable for SMT surface mount processing Read More »
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