The main differences between high-speed PCBs (printed circuit boards) and ordinary PCBs are reflected in multiple aspects such as design goals, signal transmission performance, material selection, manufacturing processes, and application scenarios.
1、 Design Objective
High speed PCB: The main goal of design is to ensure the integrity and stability of signals during high-speed transmission, typically used in devices that require processing high-frequency signals.
Ordinary PCB: The design goal is relatively broad, mainly to meet the connection and signal transmission needs of general electronic devices.
2、 Signal transmission performance
High speed PCB: It has a high signal transmission rate, usually with signal frequencies exceeding 100MHz or signal transmission rates exceeding 1ns (nanoseconds).
The requirements for signal integrity and clock synchronization are extremely high, requiring the use of differential signal wiring, impedance control, and other technologies to ensure clear and lossless transmission of signals.
It has the advantages of low signal attenuation, low crosstalk, and low noise to meet the signal quality requirements of high-speed digital circuits.
Ordinary PCB: The signal transmission rate is relatively low, usually processing lower frequency signals.
The requirements for signal integrity and clock synchronization are relatively low, and the design difficulty is relatively simple.
3、 Material selection
High speed PCB: Low loss, low dielectric constant (Dk), and low dielectric loss factor (Df) boards are usually selected to reduce delay and energy loss during signal transmission.
Material selection also needs to consider heat dissipation performance to meet the heat management requirements generated during high-speed operation.
Ordinary PCB: a material with lower usage cost and average performance.
The requirements for heat dissipation performance are usually low.
4、 Manufacturing process
High speed PCB: Manufacturing processes require higher precision and control to ensure the flatness of PCB boards, the accuracy of solder pads, and the precision of fine structures.
Advanced manufacturing technologies and equipment such as laser drilling and precision electroplating are required.
Ordinary PCB: The manufacturing process is relatively simple and the cost is low.
Adopting traditional manufacturing techniques and equipment.
5、 Application scenarios
High speed PCB: mainly used in devices that require high-speed data transmission, such as high-speed servers, wireless communication devices, network equipment, and high-performance computers.
It is also widely used in medical, military, aerospace and other fields to meet the high requirements for signal transmission speed and stability.
Ordinary PCB: widely used in general electronic devices, such as household appliances, office equipment, consumer electronics, etc.
These devices usually do not require high-speed data transmission, so they can use regular PCB boards.
There are significant differences between high-speed PCBs and ordinary PCBs in terms of design goals, signal transmission performance, material selection, manufacturing processes, and application scenarios.
These differences enable high-speed PCBs to meet the high requirements of high-speed digital circuits for signal integrity and stability, while ordinary PCBs are suitable for the connection and signal transmission needs of general electronic devices.
