SMT surface mount technology is a new generation of electronic assembly technology that evolved from hybrid integrated circuit technology. It takes surface mount technology and reflow soldering technology as its core, greatly promoting the miniaturization and multifunctionality of electronic products. The SMT production line achieves high-speed and precise placement and soldering of electronic components on PCB (Printed Circuit Board) through a series of precision equipment collaborative operations, providing a solid guarantee for mass production and low defect rate production.
Printing machine: The printing machine is responsible for evenly printing solder paste onto the solder pads of the PCB, preparing for subsequent mounting work. Using template printing technology, the solder paste is evenly applied to the solder pads through a precisely controlled scraper, requiring high printing accuracy and good consistency.
SMT machine: SMT machine is the core equipment of SMT production line, responsible for accurately mounting surface mount components (SMD) onto the solder pads of PCB. High speed, high precision, and multifunctionality are prominent features of modern surface mount machines. Through advanced visual recognition systems and precise robotic arms, precise positioning and mounting of components can be achieved.
Reflow soldering furnace: Reflow soldering furnace is a key equipment for soldering SMD, which melts solder paste and fixes SMD on PCB through precise temperature control curve. Reflow soldering furnaces need to have precise temperature control capabilities to ensure the stability and consistency of soldering quality. At the same time, it is necessary to consider the impact of thermal stress on PCB and SMD to ensure that no damage occurs during the soldering process.
Plug in equipment: Although SMT production lines mainly use surface mount technology, some products still require plug-in components. The plugin device is responsible for inserting plugin components into the corresponding holes on the PCB. Plug in devices need to have a high degree of automation to improve production efficiency and reduce errors caused by manual intervention.
Wave soldering furnace: For the soldering of plug-in components, a wave soldering furnace is an essential equipment. It welds plug-in components through molten solder peaks. The wave soldering furnace requires precise control of the shape and temperature of the soldering wave peaks to ensure the stability and consistency of the soldering quality.
AOI (Automatic Optical Inspection Instrument): AOI is responsible for the final quality inspection of PCBA to ensure that the welding quality meets the standards. Through high-speed, high-resolution cameras and advanced image processing algorithms, AOI can quickly and accurately detect welding defects such as multi tin, bridging, and monuments, improving product quality and customer satisfaction.
