The PCB immersion gold process, also known as Electroless Nickel/Oxidation Gold (ENIG), is a widely used technique in surface treatment of circuit boards.Its uniqueness is mainly reflected in the following aspects:
1、 Excellent weldability
The metal layer formed by the immersion process has good coplanarity and weldability.
This process can uniformly deposit a layer of nickel and gold on the surface of the solder pad, making its surface smooth and flat, providing good conditions for welding. Compared with other surface treatments, the crystal structure formed by gold deposition is easier to weld and has better performance.
2、 Excellent corrosion resistance
The gold deposition layer can effectively block external oxygen, humidity, and chemical erosion, and has extremely high corrosion resistance, which can greatly improve the stability and service life of PCB in harsh environments.
3、 Good conductivity
The deposited gold layer has excellent conductivity. As a thin layer with excellent conductivity, it can reduce resistance and loss in signal transmission, thereby improving the overall performance of the circuit.
4、 Beautiful and enhance attractiveness
The PCB board after immersion in gold has a golden appearance, bright and beautiful color, which enhances its attractiveness to customers..
5、 Does not affect signal transmission
Due to the presence of only nickel and gold on the solder pads of the gold-plated plate, these two metals do not affect the transmission quality when transmitting signals in the copper layer.
This is crucial for ensuring the normal operation and performance stability of electronic products.
6、 Not prone to micro short circuits
The nickel and gold layers on the gold-plated pad are tightly bonded to the solder mask layer of the circuit, making it less prone to micro short circuits.
This helps to improve the reliability and stability of electronic products.
7、 Widely applicable fields
The sinking gold process PCB is widely used in electronic products such as mobile phones and computers, as well as high-end fields such as aerospace, medical equipment, and automotive electronics.
In these fields, the connection quality and stability of electronic components are crucial for product performance and user experience.
The application of gold deposition technology enables electronic products to maintain good stability and reliability even in extreme environments.
In summary, the PCB gold deposition process has many unique features, including excellent solderability, excellent corrosion resistance, good conductivity, aesthetics and enhanced attractiveness, no impact on signal transmission, low susceptibility to micro short circuits, and a wide range of application fields.
These characteristics make the gold deposition process play an important role in surface treatment of circuit boards and provide higher stability and reliability for electronic products.
